News and Information
2022/05/30
On the morning of August 13, the launching ceremony for the centralized groundbreaking event of major projects aimed at building a demonstration zone for high-quality development and common prosperity across the province in 2021 was held. It is reported that among the projects commencing construction this time is the Yixin Semiconductor Storage Chip Packaging and Testing Project.
2022/05/30
The 5th Advanced Component Technologies and Encapsulation Materials Forum 2021 will be held in Hangzhou in September. The conference will explore the global prospects and capacity outlook for photovoltaic module markets, advanced encapsulation solutions for PERC+, TOPCon, heterojunction, perovskite, and tandem modules, as well as trends and supply-demand analyses of photovoltaic glass, backsheet, and encapsulant film technologies. It will also cover cutting-edge component technologies such as multi-busbar, non-destructive slicing, bifacial power generation, shingled modules, string welding, and micro-connection interconnects; smart manufacturing and automated equipment for PV modules; and the real LCOE and investment return advantages of 500W+/600W+ module power plants.
2022/05/30
As China intensifies its efforts to develop the semiconductor industry, newly added wafer production capacity will gradually come online. Coupled with the gradual implementation of relevant national industrial policies and financial support, demand for specialty electronic gases will continue to rise. According to forecasts by the Qianzhan Industry Research Institute, China’s market size for specialty electronic gases will reach 23 billion yuan in 2024, accounting for nearly 60% of the global market share.
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