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Nature's major progress: self-assembly engineering - controllable layer-by-layer stacking of two-dimensional materials

Nature's major progress: self-assembly engineering - controllable layer-by-layer stacking of two-dimensional materials

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  • Time of issue:2022-05-30 15:40
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(Summary description)Precisely designing high-performance semiconductor thin films with vertical structures at the atomic scale can be used in the study of modern integrated circuits and novel materials. One way to obtain such films is to achieve continuous layer-by-layer self-assembly, using two-dimensional building materials stacked vertically and connected by van der Waals forces. Graphene and transition metal dichalcogenides, two-dimensional materials with a thickness of only 1 and 3 atoms, have been used to realize some heterojunctions that were difficult to prepare earlier, and showed relatively excellent physical properties. However, there is no large-scale self-assembly method that can both maintain the intrinsic properties of 2D materials and generate interlayer interfaces, which limits the transformation of layer-by-layer self-assembly methods to a small-scale large-scale fabrication.

Nature's major progress: self-assembly engineering - controllable layer-by-layer stacking of two-dimensional materials

(Summary description)Precisely designing high-performance semiconductor thin films with vertical structures at the atomic scale can be used in the study of modern integrated circuits and novel materials. One way to obtain such films is to achieve continuous layer-by-layer self-assembly, using two-dimensional building materials stacked vertically and connected by van der Waals forces. Graphene and transition metal dichalcogenides, two-dimensional materials with a thickness of only 1 and 3 atoms, have been used to realize some heterojunctions that were difficult to prepare earlier, and showed relatively excellent physical properties. However, there is no large-scale self-assembly method that can both maintain the intrinsic properties of 2D materials and generate interlayer interfaces, which limits the transformation of layer-by-layer self-assembly methods to a small-scale large-scale fabrication.

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2022-05-30 15:40
  • Views:
Information
Precisely designing high-performance semiconductor thin films with vertical structures at the atomic scale can be used in the study of modern integrated circuits and novel materials. One way to obtain such films is to achieve continuous layer-by-layer self-assembly, using two-dimensional building materials stacked vertically and connected by van der Waals forces. Graphene and transition metal dichalcogenides, two-dimensional materials with a thickness of only 1 and 3 atoms, have been used to realize some heterojunctions that were difficult to prepare earlier, and showed relatively excellent physical properties. However, there is no large-scale self-assembly method that can both maintain the intrinsic properties of 2D materials and generate interlayer interfaces, which limits the transformation of layer-by-layer self-assembly methods to a small-scale large-scale fabrication.
 
【Introduction to Achievements】
 
Cornell University Jiwoong Park (corresponding author) et al. report a method to achieve a high level of spatial uniformity and an intrinsic sandwich interface to produce wafer-scale semiconductor thin films. The related research paper was published online in the top issue of Nature on September 21, 2017, titled "Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures". The vertical composition of the film is achieved by the self-assembly of two-dimensional material modules at the atomic scale under vacuum. At the same time, some large-scale, high-quality heterojunction films and devices were prepared, including superlattice films, batch-produced resistance-tunable tunnel junction arrays, band-tunable heterojunction tunnel diodes, and millimeter-scale ultrathin films. The stacked membranes are removable, interruptible, and compatible with interfaces such as water and plastics, allowing integration with other optical and mechanical systems.
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