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Heavy! Four giants cross-border chip making, China Mobile, Huawei, OPPO, Luxshare

Heavy! Four giants cross-border chip making, China Mobile, Huawei, OPPO, Luxshare

  • Categories:Company News
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  • Time of issue:2022-05-30 15:39
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(Summary description)On July 5th, in addition to investing in the "mother of chips" EDA company, the company's industrial and commercial data showed that Huawei's Hubble Technology recently invested in Dongguan Tianyu Semiconductor Technology Co., Ltd. The registered capital of the latter has also increased from 90.27 million yuan to 9770 yuan. million, an increase of 8%.

Heavy! Four giants cross-border chip making, China Mobile, Huawei, OPPO, Luxshare

(Summary description)On July 5th, in addition to investing in the "mother of chips" EDA company, the company's industrial and commercial data showed that Huawei's Hubble Technology recently invested in Dongguan Tianyu Semiconductor Technology Co., Ltd. The registered capital of the latter has also increased from 90.27 million yuan to 9770 yuan. million, an increase of 8%.

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2022-05-30 15:39
  • Views:
Information
On July 5th, in addition to investing in the "mother of chips" EDA company, the company's industrial and commercial data showed that Huawei's Hubble Technology recently invested in Dongguan Tianyu Semiconductor Technology Co., Ltd. The registered capital of the latter has also increased from 90.27 million yuan to 9770 yuan. million, an increase of 8%.
 
 
 
It is reported that Dongguan Tianyu Semiconductor was established in 2009 and is located in Songshan Lake High-tech Industrial Park. It is the first high-tech enterprise in my country specializing in the research and development, production and sales of third-generation semiconductor silicon carbide epitaxial wafers.
 
In 2010, the company cooperated with the Institute of Semiconductors of the Chinese Academy of Sciences to establish the "Silicon Carbide Technology Research Institute". At present, three world-class SiC-CVD and supporting testing equipment have been introduced, and the production technology has reached the international advanced level.
 
As for Shenzhen Hubble Technology, Huawei Technologies Co., Ltd. is 69% invested, Huawei Terminal invested 30%, and Hubble Technology invested 1%. It was just established in April this year.
 
The so-called third-generation semiconductors are mainly semiconductor materials represented by gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), and diamond since the 21st century, that is, high-temperature semiconductor materials. The first generation of semiconductor materials is mainly silicon (Si) and germanium (Ge), and the second generation is mainly compound semiconductor materials.
 
 
In addition, according to Digitimes, Huawei will build its first fab in Wuhan, Hubei Province, and it is expected to start production in stages from 2022. The specific source only said that it was disclosed by industry insiders, the reliability is unknown, and the official has not responded.
 
The source said that the Huawei factory was initially only used to produce optical communication chips and modules, so as to achieve self-sufficiency in semiconductors.
 
 
3. Newly designed and developed semiconductors for OPPO business
 
 
 
According to the news on Tianyancha, Dongguan Oppo Communication Technology Co., Ltd., a wholly-owned subsidiary of OPPO, has changed its business scope, adding design, development, and sales of semiconductor machine components. The fact that OPPO is making cores has been confirmed, and the first The chip or the ISP.
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