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Big News! Four Industry Giants Enter the Chip-Making Arena—China Mobile, Huawei, OPPO, and Luxshare.
Release time:
2022/05/30
On July 5, in addition to investing in EDA companies—the “mother of chips”—business registration data from Qichacha show that Huawei’s Hubble Technology recently became an investor in Dongguan Tianyu Semiconductor Technology Co., Ltd. The latter’s registered capital has also increased from 90.27 million yuan to 97.70 million yuan, representing an 8% increase.
On July 5, in addition to investing in EDA companies—the “mother of chips”—business registration data from Qichacha shows that Huawei’s Hubble Technology recently became an investor in Dongguan Tianyu Semiconductor Technology Co., Ltd. The latter’s registered capital has also increased from 90.27 million yuan to 97.70 million yuan, representing an 8% increase.
It is reported that Dongguan Tianyu Semiconductor was established in 2009 and is located in the Songshan Lake High-Tech Industrial Park. It is China's first high-tech enterprise specializing in the R&D, production, and sales of third-generation semiconductor silicon carbide epitaxial wafers.
In 2010, the company partnered with the Institute of Semiconductors of the Chinese Academy of Sciences to establish the “Silicon Carbide Technology Research Institute.” To date, the institute has introduced three world-class SiC-CVD systems along with supporting testing equipment, and its production technology has reached an internationally advanced level.
As for Shenzhen Hubble Technology, Huawei Technologies Co., Ltd. holds a 69% stake, Huawei Terminal contributes 30%, and Hubble Technology itself holds a 1% stake. The company was just established in April of this year.
The so-called third-generation semiconductors are, since the 21st century, semiconductor materials represented primarily by gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), and diamond—collectively known as high-temperature semiconductor materials. The first-generation semiconductor materials were mainly silicon (Si) and germanium (Ge), while the second generation consisted primarily of compound semiconductor materials.
Additionally, according to a report by Digitimes, Huawei will establish its first wafer fab in Wuhan, Hubei Province. Production is expected to begin in phases starting from 2022. The specific source of this information is said to be industry insiders, and its reliability remains unknown; the company has yet to issue an official response.
Sources said that Huawei’s factory will initially be used solely for the production of optical communication chips and modules, thereby achieving semiconductor self-sufficiency.
3. OPPO’s business adds semiconductor design and development.
According to information from Tianyancha, OPPO’s wholly-owned subsidiary, Dongguan Oppo Communication Technology Co., Ltd., has amended its business scope to include the design, development, and sale of semiconductor device components. The fact that OPPO is developing its own chips has now been confirmed, and its first chip may be an ISP.
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