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Electroplating Pollutant Emission Standard

In order to implement the Environmental Protection Law of the People's Republic of China, the Water Pollution Prevention and Control Law of the People's Republic of China, the Air Pollution Prevention and Control Law of the People's Republic of China, and the Marine Environmental Protection Law of the People's Republic of China, the State Council's Statement on Implementing the Scientific Outlook on Development and Strengthening the Environment This standard is formulated in accordance with laws and regulations such as Decision on Protection" and the "Opinions of the State Council on Compiling the National Main Function Zone Planning" to protect the environment, prevent and control pollution, and promote the progress of electroplating production technology and pollution control technology. This standard specifies the emission limits of electroplating water pollutants and air pollutants for electroplating enterprises and enterprises with electroplating facilities. This standard is applicable to the management of water pollutant discharge and air pollutant discharge management of existing electroplating enterprises. This standard is applicable to the environmental impact assessment, the design of environmental protection facilities, the completion of environmental protection acceptance and the management of water and air pollutant discharge after the construction projects of electroplating enterprises. This standard also applies to anodizing surface treatment process facilities. This standard applies to the discharge of pollutants permitted by law; the site selection of newly established pollution sources and the management of existing pollution sources in special protection areas shall be governed by the Law of the People's Republic of China on the Prevention and Control of Air Pollution, the Law of the People's Republic of China on the Prevention and Control of Water Pollution, "Marine Environmental Protection Law of the People's Republic of China", "Law of the People's Republic of China on the Prevention and Control of Environmental Pollution by Solid Waste", "Law of the People's Republic of China on the Prevention and Control of Radioactive Pollution", "Environmental Impact Assessment Law of the People's Republic of China" and other relevant provisions of laws, regulations and rules implement. The water pollutant discharge control requirements stipulated in this standard are applicable to the discharge behavior of enterprises to environmental water bodies. When enterprises discharge wastewater into the urban drainage system with sewage treatment plants, the toxic pollutants total chromium, hexavalent chromium, total nickel, total cadmium, total silver, total lead, and total mercury shall be subject to the corresponding discharge limits at the monitoring locations specified in this standard. The discharge control requirements of other pollutants shall be negotiated or implemented by the enterprise and the urban sewage treatment plant according to their sewage treatment capacity, and shall be reported to the local environmental protection authority for the record; the urban sewage treatment plant shall ensure that the discharged pollutants meet the relevant discharge standards. . When the construction project intends to discharge waste water into the urban drainage system where the sewage treatment plant is set up, the construction unit and the urban sewage treatment plant shall implement the provisions in the preceding paragraph. From the date of implementation of this standard, the water and air pollutant discharge control of electroplating enterprises shall be implemented in accordance with the provisions of this standard, and the "Comprehensive Wastewater Discharge Standard" (GB 8978-1996) and "Comprehensive Air Pollutant Discharge Standard" (GB 8978-1996) will no longer be implemented. 16297-1996). This standard is published for the first time.

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Monocrystalline silicon market prospect boom is on the rise

At the "PERC Technology Trends and Development Forum" held recently, some experts predicted that by 2020, the entire production capacity of mono PERC will reach 65 GW, and the shipments will account for 50% of the entire market. It is understood that in the current industrial production, the production line with high efficiency of single crystal PERC can reach more than 21.5%, and single crystal PERC has become the most attractive technical solution.

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Brine evaporator - classification and main components of evaporators

The evaporator is mainly composed of a heating chamber and an evaporation chamber. The heating chamber provides the liquid with the heat required for vaporization, and promotes the liquid to boil and vaporize; the vaporization chamber completely separates the gas-liquid two phases. The vapor generated in the heating chamber has a large amount of liquid foam. After reaching the evaporation chamber with a larger space, these liquids are separated from the vapor by self-condensation or the action of a demister. Tube condensers usually have a demister at the top of the evaporation chamber.

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Nature's major progress: self-assembly engineering - controllable layer-by-layer stacking of two-dimensional materials

Precisely designing high-performance semiconductor thin films with vertical structures at the atomic scale can be used in the study of modern integrated circuits and novel materials. One way to obtain such films is to achieve continuous layer-by-layer self-assembly, using two-dimensional building materials stacked vertically and connected by van der Waals forces. Graphene and transition metal dichalcogenides, two-dimensional materials with a thickness of only 1 and 3 atoms, have been used to realize some heterojunctions that were difficult to prepare earlier, and showed relatively excellent physical properties. However, there is no large-scale self-assembly method that can both maintain the intrinsic properties of 2D materials and generate interlayer interfaces, which limits the transformation of layer-by-layer self-assembly methods to a small-scale large-scale fabrication.

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Heavy! Four giants cross-border chip making, China Mobile, Huawei, OPPO, Luxshare

On July 5th, in addition to investing in the "mother of chips" EDA company, the company's industrial and commercial data showed that Huawei's Hubble Technology recently invested in Dongguan Tianyu Semiconductor Technology Co., Ltd. The registered capital of the latter has also increased from 90.27 million yuan to 9770 yuan. million, an increase of 8%.

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alert! Fraud targets chip industry

IC designers revealed that the controller (MCU) packaging capacity is currently the most tight. "The minimum order volume has increased by five times from the beginning of the year to the near future", making the MCU packaging increase by 15% this quarter. The demand for memory packaging is also strong, not only canceling the discount to customers, but also dynamically adjusting the price, with the prosperity of ASE Investment Control, Chaofeng, Nanmao, Licheng and other industry operators.

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